ReMan – Certified Remanufactured line of SUSS MicroTec quality products
SUSS Remanufactured and Certified Tools are completely reconditioned by our technical experts. Genuine spare parts and state-of-the art testing methods assure 100% conformity to original
specifications. Our remanufactured tools are fully upgraded to meet the latest technical standards and safety requirements and come with installation, process qualification and a full 6 month
warranty.
Higher value OEM remanufactured tools
Configured to meet customer specifications and safety-standards
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for
high-end fab automation, high volume production and R&D environments alike.
MJB3 / Standard / UV400
Manual Aligner
Manual mask aligner for soft contact and hard contact exposure modesFor wafers and substrates up to 3". The perfect low cost of ownership tool for research, lab, optoelectronics,small
series and pilot production applications.
MJB4 / UV400 – UV250
Manual Aligner
The MJB4 is the next generation version of the MJB3 which has set industry standards.Touch panel based user interface. Submicron resolutions down to 0.5μm possible. For wafers and
substrates up to 100mm. Exposure ranges from 450nm down to 240nm.
MA6/BA6 Gen2 (TSA/BSA)
Manual Aligner
The SUSS MA6 Mask Aligner is regarded as the benchmark in semiconductor submicron research and 3D micro-system production.Top and optional bottom side / infrared alignment. Submicron
printing down to 0.5μm (UV250). Enhanced Image Storage System (EISS)
MA8 Gen2
Manual Aligner
The SUSS MA6 Mask Aligner is regarded as the benchmark in semiconductor submicron research and 3D micro-system production.Top and optional bottom side / infrared alignment. Submicron
printing down to 0.5μm (UV250). Enhanced Image Storage System (EISS)
FE6 Flood Exposure
Manual Aligner
The FE6 is a manual fullfield exposure tool for areas up to 150 mm x 150 mmCapable of exposing the whole wafer in a single shot.
FE8 Flood Exposure
Manual Aligner
The FE8 is a manual fullfield exposure tool for areas up to 200 mm x 200 mmCapable of exposing the whole wafer in a single shot.
MA100E (TSA/BSA)
Production Aligner
100mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers / hour in first mask mode.Bottom side alignment (BSA) and AL8000 Automatic Alignment System
optional available All exposure modes: proximity, soft, hard and vacuum contact
MA150CC/E (TSA/BSA)
Production Aligner
150mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers / hour in first mask mode.Bottom side alignment (BSA) and AL3000 Automatic Alignment System
optional available. All exposure modes: proximity, soft, hard and vacuum contact.
MA150E
Production Aligner
150mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers / hour in first mask mode. Bottom side alignment (BSA) and AL8000 Automatic Alignment System
optional available. All exposure modes: proximity, soft, hard and vacuum contact
MA200E
Production Aligner
200mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers / hour in first mask mode.Bottom side alignment (BSA) and AL3000 Automatic Alignment System
optional available. All exposure modes: proximity, soft, hard and vacuum contact.
Coater & Developer
SUSS MicroTec spin coaters and spray coaters have become synonymous with premium performance, ease of use, flexibility and enhanced coating mastery. With a complete line of compact and user-friendly
resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec spin coaters and spray coaters enable the formation of resist layers
ranging from below 1 µm to over 500 µm.
SD12
Semi-Automated Wetprocessing System
The SD12 meets all expectations of a modern solvent spin processor for substrates up to Ø 12 (ø 300 mm) or substrates/masks up to 9"x9" (230x230 mm). Applications such as Lift-off with
NMP or solvent develop and clean are supported. The system can be equipped with various dispense technologies like puddle, fan or high-pressure spray (up to 120 bar) and provides an optional
media recycling. The high diversity of chucks allows secure handling, even of fragile substrates (for example, InP, GaAs).
Scriber & Metrology Equipment
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for
high-end fab automation, high volume production and R&D environments alike.
MS-100
Manual Scriber
The MS-100 is a manual scribing tool for R&D, laboratory, small series and pilot production applications.Low investment and low cost of ownership. Versatile treatment of all kind of
wafers and substrates from small pieces up to 100mm. High flexibility with various options and accessories.
Wafer Bonder, Bond Aligner & Cleaner
SUSS MicroTec’s wafer bonding platforms combine more than sixty years of microstructuring experience with solid product quality and a broad range of productivity features. Our platforms cover many
different applications in 2.5D and 3D integration, MEMS, LED and power devices as well as other area of research and development.
SB6e
Manual Wafer Bonder
Manual Wafer Bonder for 2 – 6 inch (depending on tooling).Can be used for any kind of thermo compression bonding e.g. Au-Au, Glass frit, BCB, SU8, etc. In combination with SUSS BA6
(MA/BA6) aligned bonding can be performed as well.
SB8e
Manual Wafer Bonder
Manual Wafer Bonder for 2 – 8 inch (depending on tooling).Can be used for any kind of thermo compression bonding e.g. Au-Au, Glass frit, BCB, SU8, etc. In combination with SUSS BA8
(MA/BA8) aligned bonding can be performed as well.
IR8
Inspection System / IR
Standalone IR Inspection Station. For looking through bonded wafers to inspect for voids. Array of IR sources provides uniform illumination IR camera. Windows operating system. Windows Laptop.
USB 2.0 camera. Ability to capture and store images
Data, design and specification of custom built machines depend on individual process conditions and can vary according to equipment configurations. Illustrations on this website are not legally
binding.
